KSICSubclass

KSIC 29271—Manufacture of semi-conductor manufacturing machinery

Subclass · Korean Standard Industrial Classification (Rev. 11 (2024))

Where 29271 sits

C Manufacturing
29 Manufacture of other machinery and equipment
292 Manufacture of special-purpose machinery
2927 Manufacture of semi-conductor and display component manufacturing machinery
29271 Manufacture of semi-conductor manufacturing machinery

Description

Refers to industrial activities involving the manufacture of machinery and equipment directly used in semiconductor manufacturing, such as equipment for wafer processing and semiconductor assembly. Cases involving the manufacture of equipment possessing specific functions, such as equipment related to printed circuit board manufacturing and semiconductor test and inspection machines, are excluded.

Example activities

manufacture of semiconductor assembly equipment
manufacture of wafer etching and developing machines
manufacture of photoresist developing and coating machines

Cross-references for 29271

Manufacture of semiconductor test and inspection machines ( 2721 )

Index entries for 29271

128 entries from the official KSIC alphabetic index that classify under this code.

Manufacture of electric furnaces and ovens (including induction and dielectric types) for manufacturing boules and wafers
Manufacture of electric furnaces and ovens for manufacturing semiconductor devices and electronic integrated circuits (excluding those intended for manufacturing semiconductor devices on semiconductor wafers)
Manufacture of other types of furnaces and ovens for manufacturing semiconductor devices and electronic integrated circuits
Manufacture of semiconductor wafer rapid heaters
Manufacture of other types of furnaces and ovens for manufacturing semiconductor devices and electronic integrated circuits (excluding wafer rapid heaters)
Manufacture of ion implanters for semiconductor material doping
Manufacture of machines for semiconductor wafer film formation or metal deposition
Manufacture of metalworking machine tools (including presses) for bending, folding, straightening, and unfolding for manufacturing semiconductor devices or electronic integrated circuits
For manufacturing semiconductor devices or electronic integrated circuits
Manufacture of metalworking machine tools (including presses) for bending, folding, straightening, and unfolding (numerically controlled type)
Manufacture of metalworking machine tools (including presses) for bending, folding, straightening, and unfolding for manufacturing semiconductor devices or electronic integrated circuits (numerically controlled type; for semiconductor leads)
Manufacture of metalworking machine tools (including presses) for bending, folding, straightening, and unfolding for manufacturing semiconductor devices or electronic integrated circuits (numerically controlled type; for types other than semiconductor lea
Manufacture of other machines for manufacturing semiconductor devices and electronic integrated circuits (machines for other uses; machine tools for processing mineral materials; other equipment)
Manufacture of machines for cleaning wafers, carriers, and tubes
Manufacture of machines for attaching semiconductor wafer tapes
Manufacture of machines for cutting semiconductor wafers (cutting into individual chips)
Manufacture of other machines not otherwise classified for manufacturing semiconductor devices and electronic integrated circuits
Other metalworking machine tools (including presses) for bending
Folding
Straightening
And unfolding for manufacturing semiconductor devices or electronic integrated circuits Manufacturing (excluding numerically controlled types)
Manufacturing of electromagnetic induction and dielectric furnaces and ovens for manufacturing semiconductor devices and electronic integrated circuits
Manufacturing of electric furnaces and ovens for manufacturing semiconductor devices and electronic integrated circuits (for manufacturing semiconductor devices on semiconductor wafers)
Manufacturing of machining tools for manufacturing semiconductor devices and electronic integrated circuits (based on electrochemical, electron beam, ion beam, or plasma arc methods) (semiconductor wafer stripping or cleaning machines)
Manufacturing of machining tools for manufacturing semiconductor devices and electronic integrated circuits (based on electrochemical, electron beam, ion beam, or plasma arc methods) (excluding pattern etching and cleaning machines)
Manufacturing of other machines for manufacturing semiconductor devices and electronic integrated circuits
Manufacturing of other machines for manufacturing semiconductor devices and electronic integrated circuits (for liquid or powder spraying, spraying, or atomizing)
Manufacturing of other machines for manufacturing semiconductor devices and electronic integrated circuits (sprayers for semiconductor wafer etching, stripping, and cleaning), semiconductor devices and electronic integrated circuits
Manufacturing of manufacturing machinery and equipment
Manufacturing of spin dryers (centrifugal type) (for semiconductor device and IC manufacturing)
Manufacturing of electric furnaces and ovens (including electromagnetic induction and dielectric types) for semiconductor device and electronic integrated circuit manufacturing
Manufacturing of resistance heating furnaces and ovens for semiconductor device and electronic integrated circuit manufacturing
Manufacturing of semiconductor device insertion machines (for semiconductor manufacturing)
Manufacturing of polishers for semiconductor wafer processing
Manufacturing of grinders for semiconductor wafer processing
Manufacturing of parts dedicated to machinery and equipment for semiconductor device and electronic integrated circuit assembly
Manufacturing of lead frame forming machines (for semiconductor manufacturing)
Manufacturing of lead frame cutting machines (for semiconductor manufacturing)
Manufacturing of other machinery for semiconductor device and electronic integrated circuit manufacturing (cleaning and contaminant removal machines for semiconductor package metal leads prior to the electroplating process)
Manufacturing of other machinery for semiconductor device and electronic integrated circuit manufacturing (equipment for other uses)
Manufacturing of photoresist coating, developing, and curing machines (for semiconductors)
Manufacturing of other machinery for semiconductor device and electronic integrated circuit manufacturing (other Equipment for use; machine tools for processing mineral materials)
Manufacture of other machinery for manufacturing semiconductor devices and electronic integrated circuits (equipment for other use; machine tools for processing mineral materials; grinders and polishers (including lapping machines) for semiconductor wafer
Manufacture of other machinery for manufacturing semiconductor devices and electronic integrated circuits (equipment for other use; machine tools for processing mineral materials; dicing machines for semiconductor wafer scribing and scoring)
Manufacture of other machinery for manufacturing semiconductor devices and electronic integrated circuits (equipment for other use; machine tools for processing mineral materials; dicing machines for semiconductor wafer scribing and scoring; laser-operate
Manufacture of other machinery for manufacturing semiconductor devices and electronic integrated circuits (equipment for other use; machine tools for processing mineral materials; dicing machines for semiconductor wafer scribing and scoring; those other t
Manufacture of wafer film forming machines (for semiconductor manufacturing)
Manufacture of wafer etching machines
Manufacture of photosensitive semiconductor material circuit model projection and drawing machines (machines for drawing directly on semiconductor wafers), photosensitive semiconductor material circuit models
Manufacture of projection and drawing equipment (step and repeat aligners)
Manufacture of other equipment for projecting and drawing circuit models of photosensitive semiconductor materials
Manufacture of other equipment for projecting and drawing circuit models of photosensitive semiconductor materials (laser-operated)
Manufacture of other equipment for projecting and drawing circuit models of photosensitive semiconductor materials (non-laser-operated)
Manufacture of machines for wet etching, developing, stripping, and cleaning of semiconductor wafers
Manufacture of machining tools for manufacturing semiconductor devices and electronic integrated circuits (laser, other light, photon beam, electrochemical, electron beam, ion beam, plasma arc methods; processing by removing a portion of material)
Manufacture of machining tools for manufacturing semiconductor devices and electronic integrated circuits (by laser or other light/photon beam methods; processing by removing a portion of material)
Manufacture of wafer processing machines (for semiconductors)
Manufacture of wafer processing equipment (semiconductors)
Manufacture of wafer metal deposition machines (semiconductors (for manufacturing)
Manufacturing of semiconductor device removers (for semiconductor manufacturing)
Manufacturing of machinery and equipment for semiconductor manufacturing
Manufacture of electric furnaces and ovens (electromagnetic induction and dielectric furnaces and ovens) for manufacturing boules and wafers
Manufacture of electric furnaces and ovens (resistance heating furnaces and ovens) for manufacturing boules and wafers
Manufacture of other electric furnaces and ovens for manufacturing boules and wafers
Manufacture of other machinery for manufacturing boules and wafers
Manufacture of machinery and equipment not otherwise classified for the assembly of semiconductor devices and electronic integrated circuits
Manufacture of metalworking machine tools (for semiconductor leads, including presses, including numerically controlled types) for bending, folding, straightening, and unfolding in semiconductor device and electronic integrated circuit assembly processes
Manufacture of metalworking machine tools (for non-semiconductor leads, including presses, including numerically controlled types) for bending, folding, straightening, and unfolding in semiconductor device and electronic integrated circuit assembly proces
Manufacture of wafer bumping equipment for forming connection contacts (bumps) (for processes prior to wafer cutting)
Manufacture of semiconductor package metal lead cleaning or contaminant removal equipment (limited to spraying, scattering, or atomizing of liquids or powders; for processes prior to electroplating)
Manufacture of machinery and equipment not otherwise classified for semiconductor device and integrated circuit assembly (resistance heating electric furnaces and ovens)
Manufacture of machinery and equipment not otherwise classified for semiconductor device and integrated circuit assembly (excluding machine tools, bumping machines, cleaning and contaminant removal equipment, furnaces and ovens)
Manufacture of parts dedicated to machinery and equipment for bowl and wafer manufacturing (spin dryers, single-crystal bowl growers, etc.)
Manufacture of parts dedicated to other machinery and equipment for bowl and wafer manufacturing (excluding spin dryers and single-crystal bowl growers)
Manufacture of parts dedicated to machinery and equipment for semiconductor device and integrated circuit manufacturing (centrifugal spin dryers, furnaces and ovens, etc.), photosensitive semiconductor circuit models
Manufacturing of projectors (devices for projecting circuit models onto photosensitive semiconductor materials)
Manufacturing of ion implanters for semiconductor material doping
Manufacturing of machinery and equipment for assembling semiconductor devices and electronic integrated circuits
Manufacturing of die attachers for semiconductor assembly
Manufacturing of automatic tape adhesives and wire adhesives
Manufacturing of machines for inserting and removing semiconductor devices
Manufacturing of machines for forming semiconductor device packages or cutting and forming lead frames
Manufacturing of encapsulation equipment for semiconductor assembly
Manufacturing of other machinery and equipment for assembling semiconductor devices and electronic integrated circuits
Manufacturing of machines for mounting solder balls on printed circuit boards and ceramic substrates for semiconductor manufacturing
Manufacturing of machines for attaching and separating ceramic plates for wafers
Manufacturing of molds for injection and compression molding of rubber and plastics (for semiconductor assembly)
Manufacturing of machines for attaching semiconductor dies or washing wafers, carriers, and tubes
Manufacturing of machining tools for manufacturing semiconductor devices and electronic integrated circuits (based on electrochemical, electron beam, ion beam, or plasma arc methods) (for dry etching patterns of semiconductor materials), semiconductor dev
Manufacturing of laser cutters for manufacturing electronic integrated circuits (used to cut connecting paths by a laser beam)
Manufacturing of machinery for manufacturing semiconductor devices and electronic integrated circuits (processing materials by removing materials in the semiconductor wafer manufacturing process)
Manufacturing of machining tools for manufacturing semiconductor devices and electronic integrated circuits (using laser or other light beam/photon beam methods; processing by removing a portion of material and tools other than laser cutters)
Manufacturing of machining tools for manufacturing semiconductor devices and electronic integrated circuits (using electrochemical, electron beam, ion beam, or plasma arc methods)
Manufacturing of machinery and equipment for semiconductor assembly
Manufacturing of wafer etching equipment (semiconductor)
Manufacturing of wafer developing machines (semiconductor)
Manufacturing of photoresist coating machines (for semiconductors)
Manufacturing of photoresist developing machines (for semiconductors)
Manufacturing of machinery for semiconductor manufacturing
Manufacturing of semiconductor coating machines (applicators)
Manufacturing of etching machines (for semiconductors); and other machines for bending, folding, straightening, and unfolding semiconductor devices or electronic integrated circuits.
Manufacture of metalworking machine tools (including presses) (excluding numerically controlled types; for semiconductor leads)
Manufacture of other metalworking machine tools (including presses) for bending, folding, straightening, and unfolding for the
Manufacture of semiconductor devices or electronic integrated circuits (excluding numerically controlled types; for semiconductor leads)
Manufacture of circuit model projection and drawing equipment for photosensitive semiconductor materials
Manufacture of wafer deposition machines (for semiconductors)
Manufacture of electrostatic chucks for wafer fixing
Manufacture of package assembly machines (for semiconductors)
Manufacture of photoresist curing machines (for semiconductors)
Manufacture of photoresist coating machines (for semiconductors)
Manufacture of developing machines (for semiconductor wafers)
Manufacture of machines and equipment for processing boules and wafers
Manufacture of spin dryers (centrifugal type) for processing boules and wafers
Manufacture of machines for growing single-crystal boules
Manufacture of machine tools for processing boules and wafers
Manufacture of fine cutting equipment for single-crystal boules, single crystal
Manufacture of boule cutting machines (laser-operated)
Manufacture of single-crystal boule cutting machines (non-laser-operated)
Manufacture of grinders and polishers (including lapping machines) for wafer processing
Manufacture of other machine tools for boule and wafer processing
Manufacture of other processing machine tools for boule and wafer manufacturing (processing by removing a portion of material using laser, other light, photon beam, electrochemical, electron beam, ion beam, or plasma arc methods)
Manufacture of other processing machine tools for boule and wafer manufacturing (using laser or other light/photon beam methods)
Manufacture of other processing machine tools for boule and wafer manufacturing (using laser or other light/photon beam methods; machines that process material by removing material)
Manufacture of other processing machine tools for boule and wafer manufacturing (using laser or other light/photon beam methods; material removal
Manufacture of items other than machining
Manufacture of other machining machine tools for manufacturing boules and wafers (by electrochemical, electron beam, ion beam, or plasma arc methods)
Manufacture of other machining machine tools for manufacturing boules and wafers (by electrochemical, electron beam, ion beam, or plasma arc methods; equipment for stripping and cleaning wafers)
Manufacture of other machining tools for manufacturing boules and wafers (those using electrochemical, electron beam, ion beam, or plasma arc methods; excluding equipment for stripping and cleaning wafers).