ICNEA 3973—Integrated circuit manufacturing

Where 3973 sits

1. C Manufacturing industry
2. 39 Computer, communications and other electronic equipment manufacturing industry
3. 397 Electronic device manufacturing
4. 3973 Integrated circuit manufacturing

What 3973 includes

• Refers to the manufacture of monolithic integrated circuits and hybrid integrated circuits.
• Including manufacturing activities for the following integrated circuits：
• Integrated circuit discs: 12-inch integrated circuit discs, 8-inch integrated circuit discs, 6-inch integrated circuit discs, 5-inch integrated circuit discs, 4-inch integrated circuit discs, integrated circuit discs below 4 inches;
• Integrated circuit packaging series: SOT (SOD) series, DIP series, SOP/SOJ series, PQFP series, BGA/PGA series, FlipChip series, CSP series, MCP series, other integrated circuit packaging series;
• Integrated circuit finished products;
• MOS micro devices: MOS_MPU micro devices, MOS_MCP micro devices, MOS_DSP micro devices;
• Logic circuit: general purpose digital bipolar circuit, general purpose MOS logic circuit, gate array, field programmable logic gate array (FPGA);
• Memory: DRAM memory, SRAM memory, EPROM (rewritable read-only memory), Flash memory, other memory;
• Analog circuit: amplifier circuit, interface circuit, voltage calibration circuit, digital/analog, analog/digital conversion circuit, comparator circuit, other analog circuits;
• Special circuits: special circuits for consumer electronics, special circuits for computers and network equipment, special circuits for communications, special circuits for automotive electronics, special circuits for power management, and other special circuits;
• Smart card chip and electronic tag chip: contact smart card chip, contactless smart card chip, reader circuit, other smart card chip and electronic tag chip;
• Sensor circuit;
• Microwave integrated circuits: microwave monolithic integrated circuits, other microwave integrated circuits;
• Hybrid integrated circuits: thin-film hybrid integrated circuits, thick-film hybrid integrated circuits, microwave hybrid integrated circuits, and other hybrid integrated circuits;
• Integrated circuit module;
• Multi-chip package assembly (MCM).

3973 in other systems