JSICIndustry
JSIC 2842—Electronic circuit implementation board
Industry · Japan Standard Industrial Classification (Rev. 14 (2023))
Where 2842 sits
- E Manufacturing
- 28 Electronic parts, devices and electronic circuits
- 284 Electronic circuit
- 2842 Electronic circuit implementation board
What 2842 includes
- This refers to establishments primarily engaged in manufacture of Electronic circuit implementation substrate (those composed of electronic circuit board and mounted parts, having electric interconnecting).
- The major products are printed circuit implementation board (those composed of printed circuit board and mounted parts, having electric interconnecting), module implementation board (those composed of module board and mounted parts, having electric interconnecting), etc.
What 2842 excludes
- However, the establishments engaged in manufacturing or assembling the finished electric apparatus are classified in the Major Group 29 [291-297], and those establishments engaged in manufacturing or assembling the finished information and communication apparatus are classified in the Major Group 30 [301-303] respectively, and the unit parts are classified in the Group [285].
2842 in other systems
ANZSICAustralia · New Zealand
- 2421 Computer and Electronic Office Equipment Manufacturing approximate via ISIC 2611
- 2429 Other Electronic Equipment Manufacturing approximate via ISIC 2611
- 2422 Communication Equipment Manufacturing approximate via ISIC 2611
- 2431 Electric Cable and Wire Manufacturing approximate via ISIC 2611
- 2439 Other Electrical Equipment Manufacturing approximate via ISIC 2611
ATECOItaly
- 26.12 Manufacture of loaded electronic boards approximate via ISIC 2611
- 26.11 Manufacture of electronic components approximate via ISIC 2611
- 26.12.00 Manufacture of loaded electronic boards inferred via ISIC 2611
- 26.11.00 Manufacture of electronic components inferred via ISIC 2611
- 26.12.0 Manufacture of loaded electronic boards broader via ISIC 2611
- 26.11.0 Manufacture of electronic components broader via ISIC 2611
CNAE BrazilBrazil
- 2610-8/00 Manufacturing of electronic components inferred via ISIC 2611
- 2632-9/00 Manufacture of telephone sets and other communication equipment, parts and accessories inferred via ISIC 2619
- 2631-1/00 Manufacturing of communication transmission equipment, parts and accessories inferred via ISIC 2611
- 2621-3/00 Computer equipment manufacturing inferred via ISIC 2611
- 2622-1/00 Manufacturing of peripherals for computer equipment inferred via ISIC 2619
- 26 Manufacturing of computer equipment, electronic and optical products broader via ISIC 2611
- C Manufacturing industries broader via ISIC 2611
- 26.1 Manufacturing of electronic components broader via ISIC 2611
CNAESpain
- 26.12 Manufacture of assembled printed circuit boards approximate via ISIC 2611
- 26.11 Manufacturing of electronic components approximate via ISIC 2611
HSICHong Kong
- 21 Manufacture of pharmaceuticals, medicinal chemical and botanical products inferred via ISIC 2619
- 29 Body assembly of motor vehicles inferred via ISIC 2611
- 19 Manufacture of coke and refined petroleum products inferred via ISIC 2619
- 11 Manufacture of beverages inferred via ISIC 2619
- 31 Manufacture of furniture inferred via ISIC 2619
- 2619 Manufacture of electronic parts and components n.e.c. inferred via ISIC 2611
- 2611 Manufacture of electronic parts and components for computer and telecommunications equipment inferred via ISIC 2611
- 2672 Manufacture of other optical instruments and equipment (except ophthalmic goods) n.e.c. inferred via ISIC 2611
ICNEAChina
- 3982 Electronic circuit manufacturing approximate via ISIC 2611
- 3985 Electronic special material manufacturing approximate via ISIC 2611
- 3824 Manufacturing of power electronic components approximate via ISIC 2611
- 3973 Integrated circuit manufacturing approximate via ISIC 2611
- 3971 Electronic vacuum device manufacturing approximate via ISIC 2611
- 3989 Manufacturing of other electronic components approximate via ISIC 2611
- 3979 Manufacturing of other electronic devices approximate via ISIC 2611
- 3976 Optoelectronics device manufacturing approximate via ISIC 2611
ISICUnited Nations (global)
KSICSouth Korea
- 26112 Manufacture of non-memory electronic integrated circuits approximate via ISIC 2611
- 26111 Manufacture of memory electronic integrated circuits approximate via ISIC 2611
- 26222 Manufacture of rigid printed circuit boards approximate via ISIC 2611
- 26121 Manufacture of light emitting diodes approximate via ISIC 2611
- 26129 Manufacture of other diodes, transistors and similar semi-conductor devices approximate via ISIC 2611
- 26211 Manufacture of liquid crystal display components approximate via ISIC 2611
- 26212 Manufacture of organic light emitting diodes display components approximate via ISIC 2611
- 26219 Manufacture of other display component approximate via ISIC 2611
MSICMalaysia
- 26194 Manufacture of printed circuit boards approximate via ISIC 2619
- 26192 Manufacture electronic integrated circuits micro assemblies approximate via ISIC 2619
- 26110 Manufacture of solar cells, solar panels and photovoltaic inverters approximate via ISIC 2611
- 26191 Manufacture of diodes, transistors and similar semiconductor devices approximate via ISIC 2619
- 26193 Manufacture of electrical capacitors and resistors approximate via ISIC 2619
- 26195 Manufacture of display components approximate via ISIC 2619
- 26199 Manufacture of other components for electronic applications approximate via ISIC 2619
- 2619 Manufacture of electronic components and boards broader via ISIC 2619
NACEEuropean Union
- 26.12 Manufacture of loaded electronic boards approximate via ISIC 2611
- 26.11 Manufacture of electronic components approximate via ISIC 2611
NAFFrance
- 26.12 Manufacture of electronic boards approximate via ISIC 2611
- 26.11 Manufacture of electronic components approximate via ISIC 2611
- 26.12Y Manufacture of electronic boards inferred via ISIC 2619
- 26.11Y Manufacture of electronic components inferred via ISIC 2619
NAICSUnited States
- 334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing approximate via ISIC 2611
- 334412 Bare Printed Circuit Board Manufacturing approximate via ISIC 2611
- 334419 Other Electronic Component Manufacturing approximate via ISIC 2611
- 334417 Electronic Connector Manufacturing approximate via ISIC 2611
- 334413 Semiconductor and Related Device Manufacturing approximate via ISIC 2611
- 334416 Capacitor, Resistor, Coil, Transformer, and Other Inductor Manufacturing approximate via ISIC 2611
NAICS CanadaCanada
- 81 Other services (except public administration) inferred via ISIC 2619
- 334410 Semiconductor and other electronic component manufacturing inferred via ISIC 2619
- 31-33 Manufacturing broader via ISIC 2619
- 3344 Semiconductor and other electronic component manufacturing broader via ISIC 2619
- 33441 Semiconductor and other electronic component manufacturing broader via ISIC 2619
- 334 Computer and electronic product manufacturing broader via ISIC 2611
NICIndia
- 261904 Manufacture of bare printed circuit boards, loading of components onto printed circuit boards; manufacture of interface cards (e.g. sound, video, controllers, network, modems) approximate via ISIC 2619
- 261907 Manufacture of Space Grade electronic components approximate via ISIC 2619
- 261901 Manufacture of electronic capacitors, resistors, chokes, coils, transformers (electronic) and similar components approximate via ISIC 2619
- 261903 Manufacture of integrated circuits (analog, digital or hybrid), including Application Specific IC (ASIC) approximate via ISIC 2619
- 261902 Manufacture of electron tubes, diodes, transistors and related discrete devices approximate via ISIC 2619
- 261999 Manufacture of other electronic components n.e.c, including Manufacture of inductors; Manufacture of electronic crystals and crystal assemblies; Manufacture of solenids, switches and transducers for electronic applications approximate via ISIC 2619
- 261103 Manufacture of photovoltaic/solar inverters approximate via ISIC 2611
- 261101 Manufacture of solar cells approximate via ISIC 2611
NOGASwitzerland
- 2612 Manufacture of loaded electronic boards approximate via ISIC 2611
- 2611 Manufacture of electronic components approximate via ISIC 2611
- 261200 Manufacture of loaded electronic boards inferred via ISIC 2611
- 261100 Manufacture of electronic components inferred via ISIC 2611
PKDPoland
- 26.12 Production of electronic printed circuit boards approximate via ISIC 2611
- 26.11 Production of electronic components approximate via ISIC 2611
- 26.12.Z Production of electronic printed circuit boards inferred via ISIC 2611
- 26.11.Z Production of electronic components inferred via ISIC 2619
SCIANMexico
- 334410 Manufacturing of electronic components inferred via ISIC 2619
- 339 Other manufacturing industries inferred via ISIC 2619
- 3344 Manufacturing of electronic components broader via ISIC 2619
- 31-33 Manufacturing industries broader via ISIC 2611
- 33441 Manufacturing of electronic components broader via ISIC 2611
- 334 Manufacturing of computer, communication, measurement and other electronic equipmentt, components and accessories broader via ISIC 2611
SICUnited States (legacy)
- 3672 Printed Circuit Boards approximate via ISIC 2611
- 3678 Electronic Connectors approximate via ISIC 2611
- 3674 Semiconductors and Related Devices approximate via ISIC 2611
- 3671 Electron Tubes approximate via ISIC 2611
- 3675 Electronic Capacitors approximate via ISIC 2611
- 3676 Electronic Resistors approximate via ISIC 2611
- 3677 Electronic Coils and Transformers approximate via ISIC 2611
- 3661 Telephone and Telegraph Apparatus approximate via ISIC 2611
SNISweden
- 26.12 Manufacture of loaded electronic boards approximate via ISIC 2611
- 26.11 Manufacture of electronic components approximate via ISIC 2611
- 26.120 Manufacture of loaded electronic boards inferred via ISIC 2619
- 26.110 Manufacture of electronic components inferred via ISIC 2619
SSICSingapore
- 26123 Manufacture of printed circuit boards with electronic parts approximate via ISIC 2619
- 26122 Manufacture of printed circuit boards without electronic parts approximate via ISIC 2619
- 26121 Manufacture of capacitors approximate via ISIC 2619
- 26124 Manufacture of piezo-electric devices approximate via ISIC 2619
- 26125 Manufacture of electronic display devices (except light emitting diodes) approximate via ISIC 2619
- 26126 Manufacture of electronic connectors approximate via ISIC 2619
- 26129 Manufacture of other electronic components and boards n.e.c. approximate via ISIC 2619
- 26112 Semiconductor wafer fabrication inferred via ISIC 2611
UK SICUnited Kingdom
- 26.12 Manufacture of loaded electronic boards approximate via ISIC 2611
- 26.11 Manufacture of electronic components approximate via ISIC 2611
- 26.119 Manufacture of other electronic components n.e.c. inferred via ISIC 2611
- 26.112 Manufacture of semiconductors and parts excluding photovoltaic cells inferred via ISIC 2619
- 26.111 Manufacture of solar panels, photovoltaic cells and parts thereof inferred via ISIC 2611
WZGermany
- 26.12 Manufacture of loaded electronic boards approximate via ISIC 2611
- 26.11 Manufacture of electronic components approximate via ISIC 2611
- 26.12.0 Manufacture of loaded electronic boards inferred via ISIC 2611
- 26.11.9 Manufacture of electronic components n.e.c. inferred via ISIC 2611
- 26.11.1 Manufacture of solar cells and solar modules inferred via ISIC 2619
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