ICNEAClass

ICNEA 3985—Electronic special material manufacturing

Class · Industrial Classification for National Economic Activities (GB/T 4754-2017) (GB/T 4754-2017)

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Where 3985 sits

C Manufacturing industry
39 Computer, communications and other electronic equipment manufacturing industry
398 Manufacturing of electronic components and electronic special materials
3985 Electronic special material manufacturing

What 3985 includes

Refers to the manufacture of special electronic functional materials, interconnection and packaging materials, processes and auxiliary materials used in the preparation of electronic components, components and systems, including semiconductor materials, optoelectronics materials, magnetic materials, lithium battery materials, electronic ceramic materials, copper clad plates and copper foil materials, electronic chemical materials, etc.
Including the following electronic special material manufacturing activities：
Metal soft magnetic components: silicon steel sheet, metal magnetic powder core, alloy soft magnetic, amorphous soft magnetic, nanocrystalline soft magnetic, other metal soft magnetic components;
Ferrite soft magnetic components: manganese-zinc ferrite soft magnetic components, nickel-zinc ferrite soft magnetic components, magnesium-zinc ferrite soft magnetic components, and other ferrite soft magnetic components;
Ferrite permanent magnet components: barium ferrite permanent magnet components, strontium ferrite permanent magnet components, calcium ferrite soft magnetic components, ferrite bonding components, and other ferrite permanent magnet components;
Rare earth permanent magnet components: sintered neodymium iron boron permanent magnet components, bonded neodymium iron boron permanent magnet components, samarium cobalt permanent magnet components, samarium iron nitrogen permanent magnet components, other rare earth permanent magnet components;
Permanent magnet alloys: Alnico magnets, Alnico magnets, and other permanent magnet alloys;
Injection molded permanent magnet components;
Microwave ferrite devices;
Other magnetic material components;
Magnetic material element blanks, quick-setting permanent magnets;
Electronic semiconductor materials: monocrystalline silicon, polysilicon, monocrystalline silicon slices, polysilicon slices, silicon epitaxial wafers, monocrystalline germanium, monocrystalline germanium wafers, lithium niobate single-chip, lithium tantalate single-chip, gallium arsenide single-chip, gallium arsenide epitaxial wafers and other chemicals doped for the electronics industry;
Intraocular lens materials: quartz crystal materials, sapphire crystal materials;
The following product manufacturing activities are included in this category;
High-performance hybrid LCD;
Driver IC;
High purity target material;
Organic luminous material;
Quantum dot material;
5.5 generation and above fine metal mask board;
Flexible substrate material;
Layered materials (such as nickel-cobalt-aluminum, nickel-cobalt-manganese, etc.);
Silicon material (refers to silicon single crystal, polishing sheet, epitaxial wafer, insulating silicon, germanium silicon);
Silicon compound semiconductor material;
Silicon carbide substrate material;
Sapphire substrate material;
Spinel-type lithium manganese oxide material;
Lithium titanate material;
Lithium-rich materials (such as lithium iron phosphate, etc.);
Raw materials for metal organic source extension;
Raw materials for ultra-high purity gas extension;
High-end LED packaging materials;
Non-oxide fiber optic material;
Semiconductor luminescent materials;
Photoelectric detection material;
High-end special magnetic materials;
High-end special ceramic materials;
High-end special piezoelectric crystal material;
Fuel cell related materials (such as catalysts, bipolar plates, proton exchange membranes, carbon paper, hydrogen storage materials, etc.);
Sensing materials such as giant magnetic impedance;
Conductive silver paste for chip components;
Silver powder and silver paste for front electrode for crystalline silicon solar cells;
Conductive silver paste and silver powder for touch screen;
FPC perforated conductive silver paste (for flexible printed circuit boards);
Stretchable conductive silver paste (used in wearable devices, medical care, communications);
Thick film heating silver paste (smart appliances);
Precious metal (gold, platinum, palladium, ruthenium, silver) powders and conductive pastes;
Ruthenium-based resistance slurry;
Sintered NDFEB magnet;
Bonded NdFeB magnetic powder;
Bonded NdFeB magnet;
Samarium cobalt magnet;
Samarium iron nitrogen magnetic powder;
Samarium iron nitrogen magnet;
New cerium magnet;
Rare earth permanent magnet ferrite;
Hot-pressed permanent magnet (ring);
Rare earth magnetostrictive materials (with rare earth-Fe as the main element, the magnetostrictive coefficient is above 500ppm);
Rare earth magnetic refrigeration materials;
White light LED phosphor (high-quality LED phosphor for lighting and display, encapsulated device, light efficiency 150lm/w. For bio-agricultural lighting and luminescence);
Three-primary color phosphor (three-primary color phosphor fluorescent lamp luminous efficiency ≥70lm/W);
Long afterglow phosphor (the afterglow time of long afterglow phosphor is≥10h);
Special phosphor;
Rare earth optical glass;
Rare earth halide luminous material;
Rare earth optical crystal material;
High-grade rare earth polishing material;
Rare earth polishing powder;
Rare earth zirconium-based ceramic powder material for capacitors and sensors;
Rare earth zirconium-based ceramic powder material for biomedicine;
Rare earth zirconium-based ceramic powder material for fuel cell;
High-purity cobalt target;
Nickel-platinum alloy target;
Copper and copper alloy targets;
Titanium and titanium alloy targets;
Aluminum and aluminum alloy targets;
Chrome target;
Cadmium aluminum target;
Molybdenum target;
Tungsten and tungsten alloy targets;
Tantalum target and ring parts;
Zinc-cadmium telluride target (for photovoltaic cell coating);
Golden target;
Silver target;
Platinum target;
Palladium target;
10B enriched zirconium boride target material (relative density 95%, used in the nuclear industry);
Niobium oxide sputtering target material (sputtering coating material, used in plasma displays, touch screens, etc.);
Other sputtering targets;
ITO target material for flat panel display;
Large-size tantalum target material for semiconductor;
General purpose wet electronic chemicals (single dose);
Functional wet electronic chemicals (mix);
Etching solution;
Developer;
Stripping solution;
Thinner;
Cleaning agent;
Metal protective liquid;
Photoresist remover;
Passivation solution;
TSV-Deep hole copper plating solution;
Electronic bulk gas;
Electronic special gas;
Photoresist and supporting reagents (integrated circuit);
Grinding fluid and supporting chemicals in CMP materials, grinding pad materials (integrated circuits);
Electroplating chemicals and supporting materials (for integrated circuit manufacturing);
Liquid crystal orienting agent and supporting chemicals (for new display);
High-purity metal organic compounds (MO source) (＞5N);
Electronic grade phenolic resin;
Electronic grade epoxy resin;
Lithium-ion battery electrolyte;
Monocrystalline silicon wafers of 6in, 8in and above;
Electronic grade monocrystalline silicon wafer;
Polysilicon wafers (regional smelting of polysilicon);
Silicon epitaxial wafer;
SOI tablets (originally only epitaxial tablets were included);
Zone fused germanium (single crystal germanium);
Gallium arsenide single chip;
Gallium arsenide epitaxial wafer;
Gallium phosphide single crystal and single chip;
Indium phosphide single crystal and single chip;
Cadmium telluride crystals and single chips;
Zinc-cadmium telluride crystals and single chips;
Gallium nitride crystals and single chips;
Silicon carbide single crystal and single chip;
Lithium niobate single chip;
Lithium tantalate single chip;
Other electronic semiconductor materials;
Single chip containing ternary and quaternary compound semiconductor;
Other information storage media materials;
Laser crystals (including YAG, Nd: YVO4, Ti: Al2O3, Nd: YLF laser crystals);
Sapphire single crystal and single chip (including optical window, fairing, 2-inch, 4-inch wafer);
Nonlinear optical crystals (including KTP, BBO, LBO, DKDP, ZGP, Nd:GCOB nonlinear crystals);
Piezoelectric crystals (including quartz, LN, LT, LGN and other crystals);
Scintillating crystals (including CdWO4, BGO, NaI (Tl), CsI (Tl) crystals);
Acousto-optic crystals (including fused silica, PbMO4, TeO2 crystals);
Photorefraction crystal;
Magneto-optical crystal (YIG crystal);
Pyroelectric crystals (including TGS, LT, PMNPT crystals);
Monocrystalline silicon ingot;
Cadmium telluride;
Special silver paste;
Crystalline silicon material;
Monocrystalline silicon wafer;
Photovoltaic cell materials (refers to high-efficiency, low-cost, and new solar materials).