PKDGroup
PKD 26.1—Production of electronic components and printed circuits
Group · Polska Klasyfikacja Działalności (2025)
Where 26.1 sits
- C Industrial Processing
- 26 Production of computers, electronic and optical products
- 26.1 Production of electronic components and printed circuits
Contains 2 narrower codes
What 26.1 includes
- For details on Industry Group 26.1, refer to the industry descriptions under its subcategories
26.1 in other systems
ANZSICAustralia · New Zealand
- 242 Computer and electronic equipment manufacturing approximate via ISIC 261
- 243 Electrical equipment manufacturing approximate via ISIC 261
- 2421 Computer and Electronic Office Equipment Manufacturing inferred via ISIC 261
- 2429 Other Electronic Equipment Manufacturing inferred via ISIC 261
- 2431 Electric Cable and Wire Manufacturing inferred via ISIC 261
- 2422 Communication Equipment Manufacturing inferred via ISIC 261
- 2439 Other Electrical Equipment Manufacturing inferred via ISIC 261
ATECOItaly
- 26.1 Manufacture of electronic components and boards exact via ISIC 26.1
- 26.11.00 Manufacture of electronic components inferred via ISIC 261
- 26.12.00 Manufacture of loaded electronic boards inferred via ISIC 261
- 26.11 Manufacture of electronic components broader via ISIC 261
- 26.12 Manufacture of loaded electronic boards broader via ISIC 261
- 26.11.0 Manufacture of electronic components broader via ISIC 261
- 26.12.0 Manufacture of loaded electronic boards broader via ISIC 261
CNAE BrazilBrazil
- 2610-8/00 Manufacturing of electronic components inferred via ISIC 261
- 2632-9/00 Manufacture of telephone sets and other communication equipment, parts and accessories inferred via ISIC 261
- 2631-1/00 Manufacturing of communication transmission equipment, parts and accessories inferred via ISIC 261
- 2622-1/00 Manufacturing of peripherals for computer equipment inferred via ISIC 261
- 2621-3/00 Computer equipment manufacturing inferred via ISIC 261
- 26 Manufacturing of computer equipment, electronic and optical products broader via ISIC 261
- 26.1 Manufacturing of electronic components broader via ISIC 261
- C Manufacturing industries broader via ISIC 261
CNAESpain
- 26.1 Manufacturing of electronic components and assembled printed circuit boards exact via ISIC 26.1
- 26.11 Manufacturing of electronic components inferred via ISIC 261
- 26.12 Manufacture of assembled printed circuit boards inferred via ISIC 261
HSICHong Kong
- 267 Manufacture of optical instruments and equipment (except ophthalmic goods) inferred via ISIC 261
- 264 Manufacture of audio and video equipment inferred via ISIC 261
- 29 Body assembly of motor vehicles inferred via ISIC 261
- 31 Manufacture of furniture inferred via ISIC 261
- 11 Manufacture of beverages inferred via ISIC 261
- 2611 Manufacture of electronic parts and components for computer and telecommunications equipment inferred via ISIC 261
- 190 Manufacture of coke and refined petroleum products inferred via ISIC 261
- 261900 Manufacture of electronic parts and components n.e.c. inferred via ISIC 261
ICNEAChina
- 398 Manufacturing of electronic components and electronic special materials approximate via ISIC 261
- 397 Electronic device manufacturing approximate via ISIC 261
- 382 Power transmission and distribution and control equipment manufacturing approximate via ISIC 261
- 3824 Manufacturing of power electronic components inferred via ISIC 261
- 3989 Manufacturing of other electronic components inferred via ISIC 261
- 3982 Electronic circuit manufacturing inferred via ISIC 261
- 3981 Manufacturing of resistive, capacitive and inductive components inferred via ISIC 261
- 3983 Manufacturing of sensitive components and sensors inferred via ISIC 261
ISICUnited Nations (global)
- 261 Manufacture of electronic components and boards exact
- 2619 Manufacture of other electronic components and boards inferred via ISIC 261
- 2611 Manufacture of solar cells, solar panels and photovoltaic inverters inferred via ISIC 261
JSICJapan
- 284 Electronic circuit approximate via ISIC 261
- 282 Electronic parts approximate via ISIC 261
- 281 Electronic devices approximate via ISIC 261
- 285 Unit parts approximate via ISIC 261
- 289 Other electronic parts, devices and electronic circuits approximate via ISIC 261
- 283 Storage media approximate via ISIC 261
- 2899 Other electronic parts, devices and electronic circuits inferred via ISIC 261
- 2842 Electronic circuit implementation board inferred via ISIC 261
KSICSouth Korea
- 262 Manufacture of electronic components approximate via ISIC 261
- 261 Manufacture of semiconductor approximate via ISIC 261
- 26111 Manufacture of memory electronic integrated circuits inferred via ISIC 261
- 26112 Manufacture of non-memory electronic integrated circuits inferred via ISIC 261
- 26299 Manufacture of electronic tubes, interface cards and other electronic components n.e.c. inferred via ISIC 261
- 26224 Manufacture of loading of electronic components onto PCB inferred via ISIC 261
- 26223 Manufacture of flexible and other printed circuit boards inferred via ISIC 261
- 26293 Manufacture of electronic coils, transformers and other inductors inferred via ISIC 261
MSICMalaysia
- 261 Manufacture of electronic components and boards exact via ISIC 261
- 26199 Manufacture of other components for electronic applications inferred via ISIC 261
- 26192 Manufacture electronic integrated circuits micro assemblies inferred via ISIC 261
- 26194 Manufacture of printed circuit boards inferred via ISIC 261
- 26195 Manufacture of display components inferred via ISIC 261
- 26193 Manufacture of electrical capacitors and resistors inferred via ISIC 261
- 26110 Manufacture of solar cells, solar panels and photovoltaic inverters inferred via ISIC 261
- 26191 Manufacture of diodes, transistors and similar semiconductor devices inferred via ISIC 261
NACEEuropean Union
- 26.1 Manufacture of electronic components and boards exact
- 26.11 Manufacture of electronic components inferred via ISIC 261
- 26.12 Manufacture of loaded electronic boards inferred via ISIC 261
NAFFrance
- 26.1 Manufacture of components and electronic cards exact via ISIC 26.1
- 26.11Y Manufacture of electronic components inferred via ISIC 261
- 26.12Y Manufacture of electronic boards inferred via ISIC 261
- 26.11 Manufacture of electronic components broader via ISIC 261
- 26.12 Manufacture of electronic boards broader via ISIC 261
NAICSUnited States
- 3344 Semiconductor and Other Electronic Component Manufacturing exact via ISIC 261
- 334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing inferred via ISIC 261
- 334419 Other Electronic Component Manufacturing inferred via ISIC 261
- 334412 Bare Printed Circuit Board Manufacturing inferred via ISIC 261
- 334417 Electronic Connector Manufacturing inferred via ISIC 261
- 334413 Semiconductor and Related Device Manufacturing inferred via ISIC 261
- 334416 Capacitor, Resistor, Coil, Transformer, and Other Inductor Manufacturing inferred via ISIC 261
- 33441 Semiconductor and Other Electronic Component Manufacturing broader via ISIC 261
NAICS CanadaCanada
- 334410 Semiconductor and other electronic component manufacturing inferred via ISIC 261
- 3344 Semiconductor and other electronic component manufacturing broader via ISIC 261
- 33441 Semiconductor and other electronic component manufacturing broader via ISIC 261
NICIndia
- 261 Manufacture of electronic components and boards exact via ISIC 261
- 261907 Manufacture of Space Grade electronic components inferred via ISIC 261
- 261901 Manufacture of electronic capacitors, resistors, chokes, coils, transformers (electronic) and similar components inferred via ISIC 261
- 261904 Manufacture of bare printed circuit boards, loading of components onto printed circuit boards; manufacture of interface cards (e.g. sound, video, controllers, network, modems) inferred via ISIC 261
- 261999 Manufacture of other electronic components n.e.c, including Manufacture of inductors; Manufacture of electronic crystals and crystal assemblies; Manufacture of solenids, switches and transducers for electronic applications inferred via ISIC 261
- 261903 Manufacture of integrated circuits (analog, digital or hybrid), including Application Specific IC (ASIC) inferred via ISIC 261
- 261905 Manufacture of display components (plasma, polymer, LCD, LED) inferred via ISIC 261
- 261902 Manufacture of electron tubes, diodes, transistors and related discrete devices inferred via ISIC 261
NOGASwitzerland
- 261 Manufacture of electronic components and boards exact via ISIC 26.1
- 261100 Manufacture of electronic components inferred via ISIC 261
- 261200 Manufacture of loaded electronic boards inferred via ISIC 261
- 2611 Manufacture of electronic components broader via ISIC 261
- 2612 Manufacture of loaded electronic boards broader via ISIC 261
SCIANMexico
- 334410 Manufacturing of electronic components inferred via ISIC 261
- 3344 Manufacturing of electronic components broader via ISIC 261
- 33441 Manufacturing of electronic components broader via ISIC 261
SICUnited States (legacy)
- 367 Electronic Components and Accessories approximate via ISIC 261
- 357 Computer and Office Equipment approximate via ISIC 261
- 366 Communications Equipment approximate via ISIC 261
- 3679 Electronic Components, NEC inferred via ISIC 261
- 3672 Printed Circuit Boards inferred via ISIC 261
- 3677 Electronic Coils and Transformers inferred via ISIC 261
- 3678 Electronic Connectors inferred via ISIC 261
- 3675 Electronic Capacitors inferred via ISIC 261
SNISweden
- 26.1 Manufacture of electronic components and boards exact via ISIC 26.1
- 26.110 Manufacture of electronic components inferred via ISIC 261
- 26.120 Manufacture of loaded electronic boards inferred via ISIC 261
- 26.11 Manufacture of electronic components broader via ISIC 261
- 26.12 Manufacture of loaded electronic boards broader via ISIC 261
SSICSingapore
- 261 Manufacture of electronic components and boards exact via ISIC 261
- 26123 Manufacture of printed circuit boards with electronic parts inferred via ISIC 261
- 26129 Manufacture of other electronic components and boards n.e.c. inferred via ISIC 261
- 26122 Manufacture of printed circuit boards without electronic parts inferred via ISIC 261
- 26113 Assembly and testing of semiconductors inferred via ISIC 261
- 26119 Manufacture of semiconductor devices n.e.c. inferred via ISIC 261
- 26112 Semiconductor wafer fabrication inferred via ISIC 261
- 26115 Manufacture of solar cells inferred via ISIC 261
UK SICUnited Kingdom
- 26.1 Manufacture of electronic components and boards exact via ISIC 26.1
- 26.12 Manufacture of loaded electronic boards inferred via ISIC 261
- 26.119 Manufacture of other electronic components n.e.c. inferred via ISIC 261
- 26.112 Manufacture of semiconductors and parts excluding photovoltaic cells inferred via ISIC 261
- 26.111 Manufacture of solar panels, photovoltaic cells and parts thereof inferred via ISIC 261
- 26.11 Manufacture of electronic components broader via ISIC 261
WZGermany
- 26.1 Manufacture of electronic components and boards exact via ISIC 26.1
- 26.11.9 Manufacture of electronic components n.e.c. inferred via ISIC 261
- 26.12.0 Manufacture of loaded electronic boards inferred via ISIC 261
- 26.11.1 Manufacture of solar cells and solar modules inferred via ISIC 261
- 26.11 Manufacture of electronic components broader via ISIC 261
- 26.12 Manufacture of loaded electronic boards broader via ISIC 261
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