SSIC 28273—Manufacture/repair of semiconductor assembly and testing equipment

Where 28273 sits

1. C Manufacturing
2. 28 Manufacture of machinery and equipment
3. 282 Manufacture of special purpose machinery
4. 2827 Manufacture and Repair of Semiconductor Related Equipment
5. 28273 Manufacture/repair of semiconductor assembly and testing equipment

What 28273 includes

• This sub-class includes the manufacture, repair and/or maintenance of semiconductor assembly and/or packaging machinery, such as computer burn-in systems.

What 28273 excludes

• Manufacture of probe cards, see 28271
• Manufacture of bonding tools, see 28272

28273 in other systems